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  to our customers, old company name in catalogs and other documents on april 1 st , 2010, nec electronics corporation merged with renesas technology corporation, and renesas electronics corporation took over all the business of both companies. therefore, although the old company name remains in this document, it is a valid renesas electronics document. we appreciate your understanding. renesas electronics website: http://www.renesas.com april 1 st , 2010 renesas electronics corporation issued by: renesas electronics corporation (http://www.renesas.com) send any inquiries to http://www.renesas.com/inquiry.
notice 1. all information included in this document is current as of the date this document is issued. such information, however, is subject to change without any prior notice. before purchasing or using any renesas el ectronics products li sted herein, please confirm the latest product information with a renesas electronics sales office. also , please pay regular and careful attention to additional and different information to be disclosed by rene sas electronics such as that disclosed through our website. 2. renesas electronics does not assume any liability for infringeme nt of patents, copyrights, or other intellectual property ri ghts of third parties by or arising from the use of renesas electroni cs products or techni cal information descri bed in this document . no license, express, implied or otherwise, is granted hereby under any patents, copyri ghts or other intell ectual property right s of renesas electronics or others. 3. you should not alter, modify, copy, or otherwise misappropriate any re nesas electronics product, wh ether in whole or in part . 4. descriptions of circuits, software and other related informat ion in this document are provided only to illustrate the operat ion of semiconductor products and application examples. you are fully re sponsible for the incorporation of these circuits, software, and information in the design of your equipment. renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. when exporting the products or technology described in this doc ument, you should comply with the applicable export control laws and regulations and follow the proc edures required by such laws and re gulations. you should not use renesas electronics products or the technology described in this docum ent for any purpose relating to mil itary applicati ons or use by the military, including but not l imited to the development of weapons of mass de struction. renesas electronics products and technology may not be used for or incor porated into any products or systems whose manufacture, us e, or sale is prohibited under any applicable dom estic or foreign laws or regulations. 6. renesas electronics has used reasonable care in preparing th e information included in this document, but renesas electronics does not warrant that such information is error free. renesas electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 7. renesas electronics products ar e classified according to the following three quality grades: ?standard?, ?high quality?, an d ?specific?. the recommended applications for each renesas electronics product de pends on the product?s quality grade, as indicated below. you must check the qua lity grade of each renesas electronics pr oduct before using it in a particular application. you may not use any renesas electronics produc t for any application categorized as ?speci fic? without the prior written consent of renesas electronics. further, you may not use any renesas electronics product for any application for which it is not intended without the prior written consent of renesas electronics. re nesas electronics shall not be in any way liable for any damages or losses incurred by you or third partie s arising from the use of any renesas electronics product for a n application categorized as ?specific? or for which the product is not intende d where you have failed to obtain the prior writte n consent of renesas electronics. the quality grade of each renesas electronics product is ?standard? unless otherwise expressly specified in a renesas electr onics data sheets or data books, etc. ?standard?: computers; office equipmen t; communications e quipment; test and measurement equipment; audio and visual equipment; home electronic a ppliances; machine tools; personal electronic equipmen t; and industrial robots. ?high quality?: transportation equi pment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; an ti- crime systems; safety equipment; and medical equipment not specif ically designed for life support. ?specific?: aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support device s or systems), surgical im plantations, or healthcare intervention (e.g. excision, etc.), and any other applicati ons or purposes that pose a di rect threat to human life. 8. you should use the renesas electronics pr oducts described in this document within the range specified by renesas electronics , especially with respect to the maximum ra ting, operating supply voltage range, movement power volta ge range, heat radiation characteristics, installation and other product characteristics. renesas electronics shall have no liability for malfunctions o r damages arising out of the use of renesas electronics products beyond such specified ranges. 9. although renesas electronics endeavors to improve the quality and reliability of its produc ts, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate a nd malfunctions under certain use conditions. fur ther, renesas electronics products are not subject to radiation resistance design. please be sure to implement safety measures to guard them against the possibility of physic al injury, and injury or damage caused by fire in the event of the failure of a renesas electronics product, such as safe ty design for hardware and software in cluding but not limited to redundancy, fire control and malfunction prevention, appropri ate treatment for aging degradation or an y other appropriate measures. because the evaluation of microcomputer software alone is very difficult , please evaluate the safety of the final products or system manufactured by you. 10. please contact a renesa s electronics sales office for details as to environmental matters such as the environmental compatibility of each renesas electronics product. please use renesas electronics products in compliance with all applicable laws and regulations that regul ate the inclusion or use of c ontrolled substances, including wi thout limitation, the eu rohs directive. renesas electronics assumes no liability for damage s or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. this document may not be reproduced or duplicated, in any form, in w hole or in part, without prio r written consent of renes as electronics. 12. please contact a renesa s electronics sales office if you have any questi ons regarding the informat ion contained in this document or renesas electroni cs products, or if you have any other inquiries. (note 1) ?renesas electronics? as used in this document means renesas electronics corporation and also includes its majority- owned subsidiaries. (note 2) ?renesas electronics product(s)? means any product developed or manufactured by or for renesas electronics.
bipolar analog integrated circuit m m m m pc3215tb 5 v, super minimold silicon mmic wideband amplifier document no. p14765ej2v0ds00 (2nd edition) date published august 2000 n cp(k) printed in japan data sheet the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec representative for availability and additional information. 2000 the mark shows major revised points. description the m pc3215tb is a silicon monolithic ic designed as wideband amplifier. the m pc3215tb is suitable to systems required wideband operation from hf to l band. this ic is manufactured using necs 30 ghz f max uhs0 (ultra h igh s peed process) silicon bipolar process. the package is 6-pin super minimold suitable for surface mount. features ? wideband response : f u = 2.9 ghz typ. @3 db bandwidth ? noise figure : nf = 2.3 db typ. @f = 1.5 ghz ? power gain : g p = 20.5 db typ. @f = 1.5 ghz ? supply voltage : v cc = 4.5 to 5.5 v ? high-density surface mounting: 6-pin super minimold package application ? systems required wideband operation from hf to l band ordering information part number package marking supplying form m pc3215tb-e3 6-pin super minimold c3h embossed tape 8 mm wide. 1, 2, 3 pins face the perforation side of the tape. qty 3 kpcs/reel. remark to order evaluation samples, please contact your local nec sales office. (part number for sample order: m pc3215tb) caution electro-static sensitive devices
data sheet p14765ej2v0ds00 2 m m m m pc3215tb pin connections pin no. pin name 1 input 2gnd 3gnd 4output 5gnd 6v cc product line-up of 5v-bias silicon mmic wideband amplifiers (t a = +25c, v cc = 5.0 v, z s = z l = 50 w w w w ) part no. f u (ghz) p o (sat) (dbm) g p (db) nf (db) i cc (ma) package marking m pc2711t 6-pin minimold m pc2711tb 2.9 +1.0 13 5.0 @f = 1 ghz 12 6-pin super minimold c1g m pc2712t 6-pin minimold m pc2712tb 2.6 +3.0 20 4.5 @f = 1 ghz 12 6-pin super minimold c1h m pc3210tb 2.3 +3.5 20 3.4 @f = 1.5 ghz 15 6-pin super minimold c2x m pc3215tb 2.9 +3.5 20.5 2.3 @f = 1.5 ghz 14 6-pin super minimold c3h remark typical performance. please refer to electrical characteristics in detail. caution the package size distinguishes between minimold and super minimold. 3 2 1 4 5 6 (top view) c3h 4 5 6 3 2 1 (bottom view)
data sheet p14765ej2v0ds00 3 m m m m pc3215tb pin explanation pin no. pin name applied voltage (v) pin voltage (v) note function and applications internal equivalent circuit 1 input ? 0.82 signal input pin. a internal matching circuit, configured with resistors, enables 50 w connection over a wideband. a multi- feedback circuit is designed to cancel the deviations of h fe and resistance. this pin must be coupled to signal source with capacitor for dc cut. 2 3 5 gnd 0 ? ground pin. this pin should be connected to system gr ound with minimum inductance. ground pattern on the board should be formed as wide as possible. all the ground pins must be connected together with wide ground pattern to decrease impedance difference. 4output ? 3.8 signal output pin. a internal matching circuit, configured with resistors, enables 50 w connection over a wideband. this pin must be coupled to next stage with capacitor for dc cut. 6v cc 4.5 to 5.5 ? power supply pin. this pin should be externally equipped with bypass capacitor to minimize ground impedance. gnd gnd in v cc out 1 6 4 3 5 2 note pin voltage is measured at v cc = 5.0 v
data sheet p14765ej2v0ds00 4 m m m m pc3215tb absolute maximum ratings parameter symbol conditions ratings unit supply voltage v cc t a = +25c 6.0 v circuit current i cc t a = +25c 30 ma input power p in t a = +25c +10 dbm power dissipation p d t a = +85c note 270 mw operating ambient temperature t a ?40 to +85 c storage temperature t stg ?55 to +150 c note mounted on 50 50 1.6-mm epoxy glass pwb, with copper patterning on both sides. recommended operating conditions parameter symbol min. typ. max. unit supply voltage v cc 4.5 5.0 5.5 v operating ambient temperature t a ?40 +25 +85 c input power p in ??0dbm input frequency f in 0.1?2.9ghz electrical characteristics (t a = +25c, v cc = 5.0 v, z s = z l = 50 w w w w ) parameter symbol test conditions min. typ. max. unit circuit current i cc no input signals 10.5 14.0 17.5 ma power gain g p f = 1.5 ghz, p in = ?30 dbm 18.5 20.5 ? db noise figure nf f = 1.5 ghz ? 2.3 3.0 db upper limit operating frequency f u 3 db down below from gain at f = 0.1 ghz 2.5 2.9 ? ghz isolation isl f = 1.5 ghz, p in = ?30 dbm 39 44 ? db input return loss rl in f = 1.5 ghz, p in = ?30 dbm 10 15 ? db output return loss rl out f = 1.5 ghz, p in = ?30 dbm 6.5 9.5 ? db 1 db compression point p-1 ?4 ?1.5 ? dbm standard characteristics (t a = +25c, v cc = 5.0 v, z s = z l = 50 w w w w ) parameter symbol test conditions reference values unit saturated output power p o(sat) p in = 0 dbm +3.5 dbm output intercept point oip 3 f 1 = 1.5 ghz, f 2 = 1.501 ghz +10 dbm gain flatness d g p f = 0.1 to 2.15 ghz 1.0 db
data sheet p14765ej2v0ds00 5 m m m m pc3215tb typical characteristics (unless otherwise specified, t a = +25 c) no input signal t a = e40 c t a = +25 c t a = +85 c circuit current vs. supply voltage supply voltage v cc (v) circuit current i cc (ma) 20 15 10 5 0 0 1 2 34 56 no input signal v cc = 5 v circuit current vs. operating ambient temperature operating ambient temperature t a ( c) circuit current i cc (ma) 20 15 10 5 0 e50 e25 0 +25 +50 +75 +100 p in = e30 dbm v cc = 4.5 v v cc = 5.0 v v cc = 5.5 v insertion power gain vs. frequency frequency f in (ghz) insertion power gain g p (db) 25 15 10 5 0 0.1 0.3 1.0 20 3.0 v cc = 5 v p in = e30 dbm t a = e40 c t a = +25 c t a = +85 c insertion power gain vs. frequency frequency f in (ghz) insertion power gain g p (db) 25 15 10 5 0 0.1 0.3 1.0 20 3.0 v cc = 4.5 v v cc = 5.0 v v cc = 5.5 v noise figure vs. frequency frequency f in (ghz) noise figure nf (db) 5 3 2 1 0 0.1 0.3 1.0 4 3.0 t a = e40 c t a = +25 c t a = +85 c noise figure vs. frequency frequency f in (ghz) noise figure nf (db) 5 3 2 1 0 0.1 0.3 1.0 4 3.0 v cc = 5 v
data sheet p14765ej2v0ds00 6 m m m m pc3215tb isolation vs. frequency frequency f in (ghz) isolation isl (db) 0 e20 e30 e40 e50 0.1 0.3 1.0 e10 3.0 isolation vs. frequency frequency f in (ghz) isolation isl (db) 0 e20 e30 e40 e50 0.1 0.3 1.0 e10 3.0 p in = e30 dbm v cc = 4.5 v v cc = 5.0 v v cc = 5.5 v v cc = 5 v p in = e30 dbm t a = e40 c t a = +25 c t a = +85 c input return loss vs. frequency frequency f in (ghz) input return loss rl in (db) 0 e20 e30 e40 e50 0.1 0.3 1.0 e10 3.0 p in = e30 dbm v cc = 4.5 v v cc = 5.0 v v cc = 5.5 v input return loss vs. frequency frequency f in (ghz) input return loss rl in (db) 0 e20 e30 e40 e50 0.1 0.3 1.0 e10 3.0 v cc = 5 v p in = e30 dbm t a = e40 c t a = +25 c t a = +85 c output return loss vs. frequency frequency f in (ghz) output return loss rl out (db) 0 e20 e30 e40 e50 0.1 0.3 1.0 e10 3.0 p in = e30 dbm v cc = 4.5 v v cc = 5.0 v v cc = 5.5 v output return loss vs. frequency frequency f in (ghz) output return loss rl out (db) 0 e20 e30 e40 e50 0.1 0.3 1.0 e10 3.0 v cc = 5 v p in = e30 dbm t a = e40 c t a = +25 c t a = +85 c
data sheet p14765ej2v0ds00 7 m m m m pc3215tb output power vs. input power input power p in (dbm) output power p out (dbm) +10 e10 e20 e30 e40 e30 e20 0 +10 output power vs. input power input power p in (dbm) output power p out (dbm) +10 e10 e20 e30 e40 e30 e20 0 +10 v cc = 4.5 v v cc = 5.0 v v cc = 5.5 v f in = 1 ghz e10 0 e10 0 t a = e40 c t a = +25 c t a = +85 c v cc = 5 v f in = 1 ghz output power vs. input power input power p in (dbm) output power p out (dbm) +10 e10 e20 e30 e40 e30 e20 0 +10 v cc = 4.5 v v cc = 5.0 v v cc = 5.5 v f in = 1.5 ghz e10 0 output power vs. input power input power p in (dbm) output power p out (dbm) +10 e10 e20 e30 e40 e30 e20 0 +10 e10 0 t a = e40 c t a = +25 c t a = +85 c v cc = 5 v f in = 1.5 ghz
data sheet p14765ej2v0ds00 8 m m m m pc3215tb output power vs. input power input power p in (dbm) output power p out (dbm) +10 e10 e20 e30 e40 e30 e20 0 +10 output power vs. input power input power p in (dbm) output power p out (dbm) +10 e10 e20 e30 e40 e30 e20 0 +10 e10 0 e10 0 v cc = 4.5 v v cc = 5.0 v v cc = 5.5 v f in = 2.15 ghz t a = e40 c t a = +25 c t a = +85 c v cc = 5 v f in = 2.15 ghz output power vs. input power input power p in (dbm) output power p out (dbm) +10 e10 e20 e30 e40 e30 e20 0 +10 e10 0 v cc = 4.5 v v cc = 5.0 v v cc = 5.5 v f in = 2.4 ghz output power vs. input power input power p in (dbm) output power p out (dbm) +10 e10 e20 e30 e40 e30 e20 0 +10 e10 0 t a = e40 c t a = +25 c t a = +85 c v cc = 5 v f in = 2.4 ghz
data sheet p14765ej2v0ds00 9 m m m m pc3215tb output power of each tone vs. input power of each tone input power of each tone p in(each) (dbm) output power of each tone p o(each) (dbm) +20 e40 e60 e80 e40 e35 e30 0 0 e25 e5 e20 e20 e15 e10 v cc = 5 v f 1 = 1 000 mhz f 2 = 1 001 mhz output power of each tone vs. input power of each tone input power of each tone p in(each) (dbm) output power of each tone p o(each) (dbm) +20 e40 e60 e80 e40 e35 e30 0 0 e25 e5 e20 e20 e15 e10 v cc = 5 v f 1 = 1 500 mhz f 2 = 1 501 mhz output power of each tone vs. input power of each tone input power of each tone p in(each) (dbm) output power of each tone p o(each) (dbm) +20 e40 e60 e80 e40 e35 e30 0 0 e25 e5 e20 e20 e15 e10 v cc = 5 v f 1 = 2 150 mhz f 2 = 2 151 mhz output power of each tone vs. input power of each tone input power of each tone p in(each) (dbm) output power of each tone p o(each) (dbm) +20 e40 e60 e80 e40 e35 e30 0 0 e25 e5 e20 e20 e15 e10 v cc = 5 v f 1 = 2 400 mhz f 2 = 2 401 mhz remark the graphs indicate nominal characteristics.
data sheet p14765ej2v0ds00 10 m m m m pc3215tb s-parameters (t a = +25 c, v cc = 5 v) s 11 -frequency start stop 0.100000000 ghz 3.100000000 ghz s 22 -frequency start stop 0.100000000 ghz 3.100000000 ghz
data sheet p14765ej2v0ds00 11 m m m m pc3215tb typical s-parameter values (t a = +25 c) v cc = 5.0 v, i cc = 16 ma frequency s 11 s 21 s 12 s 22 k mhz mag.ang.mag.ang.mag.ang.mag.ang. 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 1600.0000 1700.0000 1800.0000 1900.0000 2000.0000 2100.0000 2200.0000 2300.0000 2400.0000 2500.0000 2600.0000 2700.0000 2800.0000 2900.0000 3000.0000 3100.0000 0.207 0.190 0.186 0.192 0.200 0.201 0.204 0.206 0.210 0.212 0.218 0.217 0.221 0.228 0.233 0.238 0.244 0.246 0.248 0.246 0.241 0.236 0.229 0.219 0.215 0.213 0.221 0.234 0.253 0.264 0.283 174.1 173.1 174.3 173.8 174.5 173.0 173.0 172.4 172.7 171.4 169.4 168.4 165.9 164.7 162.3 159.5 157.2 153.9 150.6 147.4 144.9 142.2 142.2 143.5 145.7 149.3 150.1 151.3 152.1 150.7 148.7 10.788 10.714 10.565 10.359 10.225 10.116 10.116 10.122 10.186 10.182 10.208 10.296 10.248 10.438 10.369 10.554 10.492 10.483 10.408 10.405 10.267 10.039 9.896 9.684 9.348 9.068 8.673 8.437 8.080 7.791 7.458 - 4.6 - 9.8 - 14.3 - 18.3 - 21.7 - 24.9 - 28.0 - 31.1 - 34.5 - 37.7 - 41.6 - 45.6 - 49.7 - 53.9 - 58.0 - 62.7 - 67.2 - 72.2 - 76.9 - 82.2 - 87.2 - 92.7 - 97.7 - 102.4 - 107.5 - 112.0 - 116.6 - 121.1 - 124.9 - 129.4 - 132.7 0.013 0.013 0.013 0.014 0.013 0.013 0.011 0.011 0.011 0.009 0.011 0.009 0.006 0.008 0.006 0.005 0.004 0.003 0.004 0.007 0.008 0.011 0.012 0.014 0.015 0.018 0.017 0.020 0.021 0.020 0.022 6.3 - 0.5 2.7 4.7 5.3 2.1 1.6 12.9 5.1 4.1 4.9 11.0 20.5 1.6 25.7 31.6 48.5 87.2 93.4 114.5 115.4 124.0 121.6 124.9 117.8 117.3 114.4 114.0 111.6 112.5 113.7 0.285 0.282 0.283 0.285 0.286 0.286 0.288 0.289 0.290 0.295 0.299 0.300 0.299 0.307 0.310 0.316 0.317 0.318 0.323 0.323 0.319 0.312 0.306 0.292 0.279 0.270 0.256 0.248 0.237 0.232 0.229 - 3.3 - 3.7 - 4.6 - 6.2 - 7.6 - 8.8 - 10.4 - 11.7 - 13.5 - 14.9 - 16.8 - 18.0 - 20.2 - 23.1 - 24.8 - 27.5 - 30.5 - 33.3 - 36.9 - 40.6 - 44.9 - 48.9 - 52.6 - 56.3 - 59.3 - 61.7 - 63.7 - 65.1 - 67.3 - 68.0 - 70.2 3.38 3.39 3.37 3.92 3.96 3.69 3.91 4.17 3.99 4.28 4.19 4.65 5.78 6.97 6.80 11.54 11.75 13.52 8.46 7.46 6.20 4.50 4.12 3.40 3.42 3.02 3.17 2.85 2.98 2.90 3.02
data sheet p14765ej2v0ds00 12 m m m m pc3215tb test circuit v cc 1 000 pf c 1 50 w in 6 1 2, 3, 5 4 c 2 50 w 1 000 pf out c 3 1 000 pf example of application circuit 1 000 pf 1 000 pf 50 w in 6 1 2, 3, 5 4 50 w 1 000 pf out 6 1 2, 3, 5 4 1 000 pf v cc 1 000 pf 1 000 pf 50 to 200 w please connect these component to stabilize operation. the application circuits and their parameters are for reference only and are not intended for use in actual design-ins. capacitors for v cc , input and output pins 1 000 pf capacitors are recommendable as bypass capacitor for v cc pin and coupling capacitors for input/output pins. bypass capacitor for v cc pin is intended to minimize v cc pin?s ground impedance. therefore, stable bias can be supplied against v cc fluctuation. coupling capacitors for input/output pins are intended to minimize rf serial impedance and cut dc. to get flat gain from 100 mhz up, 1 000 pf capacitors are assembled on the test circuit. [actually, 1 000 pf capacitors give flat gain at least 10 mhz. in the case of under 10 mhz operation, increase the value of coupling capacitor such as 2 200 pf. because the coupling capacitors are determined by the equation of c = 1/(2 p fzs).]
data sheet p14765ej2v0ds00 13 m m m m pc3215tb illustration of the test circuit assembled on evaluation board c in out c v cc c3h 13 2 64 5 mounting direction notes 1. 2. 3. 4. 30 30 0.4 mm double sided copper clad polyimide board. back side: gnd pattern solder plated on pattern : through holes top view amp-2 c component list value c 1 000 pf
data sheet p14765ej2v0ds00 14 m m m m pc3215tb package dimensions 6-pin super minimold (unit: mm) 0.9 0.1 0.7 0 to 0.1 0.15 2.0 0.2 1.3 0.65 0.65 0.2 +0.1 e0.05 2.1 0.1 1.25 0.1 0.1 min. +0.1 e0 .05
data sheet p14765ej2v0ds00 15 m m m m pc3215tb notes on correct use (1) observe precautions for handling because of electro-static sensitive devices. (2) form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). (3) keep the track length of the ground pins as short as possible. (4) a low pass filter must be attached to v cc line. recommended soldering conditions this product should be soldered under the following recommended conditions. for soldering methods and conditions other than those recommended below, contact your nec sales representative. soldering method soldering conditions recommended condition symbol infrared reflow package peak temperature: 235c or below time: 30 seconds or less (at 210c) count: 3, exposure limit: none note ir35-00-3 vps package peak temperature: 215c or below time: 40 seconds or less (at 200c) count: 3, exposure limit: none note vp15-00-3 wave soldering soldering bath temperature: 260c or below time: 10 seconds or less count: 1, exposure limit: none note ws60-00-1 partial heating pin temperature: 300c time: 3 seconds or less (per side of device) exposure limit: none note ? note after opening the dry pack, keep it in a place below 25 c and 65% rh for the allowable storage period. caution do not use different soldering methods together (except for partial heating). for details of recommended soldering conditions for surface mounting, refer to information document semiconductor device mounting technology manual (c10535e).
m m m m pc3215tb m8e 00. 4 the information in this document is current as of august, 2000. the information is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this document. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if customers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above).


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